Target Bonding Service

The thermal and mechanical integrity of the bond between a sputtering target and its backing plate are essential to ensure optimum sputtering performance. Heeger Materials provides Indium-based Metallic Bonding, Elastomer Bonding and OFHC Copper Backing Plates at a competitive price.

Target Bonding Service There are 2 products.

Showing 1 - 2 of 2 items
  • Inquiry

    Indium-based Metallic bonding utilizes an Indium Alloy and is rated to 150 degrees C. It provides good thermal and electrical conductivity and is recommended for most sputtering applications.

  • Inquiry

    Elastomer is an alternative bonding method that touts a higher temperature capability over the indium bond. Elastomer bonds are recommended when customers are consistently melting indium bonds. The major advantages of Elastomer bonding are its low cure temperature (reducing internal bond stresses from thermal miss match) and high operation temperature...

Showing 1 - 2 of 2 items