Spherical Copper-coated Tungsten (WCu) Powder

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Spherical Copper-clad tungsten composite powder is often used in 3D printing. Tungsten-copper alloy has the characteristics of high strength, high hardness, low expansion coefficient, and so on. W-Cu composite materials can be used as electronic packaging materials and heat sink materials.

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Data sheet

ShapeSpherical / Ball Powder
Particle Size15-45μm, 15-53μm, 45-75μm, 45-105μm, 75-150μm, customized
Purity99.5%/ customized
CAS12008-30-9
Molecular FormulaSmB6

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Heeger Materials provides high-quality Spherical Copper-coated Tungsten Powder at a competitive price, which can be used in Scientific research or industrial production.

Product Specification: 5-25 μm,15-45μm,15-53μm,45-75μm,45-105μm,75-150μm.(Grain sizes can be customized at customer request)

Powder characteristics: high purity (≥ 99.9%), low oxygen (≤ 1000ppm), high sphericity (≥ 98%), uniform grain distribution, excellent mobility energy (≤10.0s/50g), high loose loading density (≥ 6.0g/cm3), and solid density (≥ 7.5g/cm3).

Applicable processes: Laser/electron beam additive manufacturing (SLM/EBM), laser direct deposition (DLD), powder thermal and other static pressure forming (HIP), metal injection forming (MIM), powder metallurgy (PM), laser melting application (LC), etc.

Powder application: Spherical Copper-coated Tungsten Powder using tungsten carbide powder as raw material, prepared through the chemical packaging process, with high spherical, good mobility, high purity, loose loading density, metal copper content, coating thickness controllable characteristics, widely used in national defense, petrochemical, mechanical equipment, medical equipment, and other fields.

Product packaging: vacuum packaging, 1 kg/bag, 2 kg/bag; iron barrel lined plastic bags 25 kg/barrels; can be specially packaged according to the user requirements.

Spherical Copper-clad tungsten composite powder Chemical Composition

Chemical  Composition

Element

Value(%)

Test Method

Element

Value(%)

Test Method

W

Bal

ICP-AES

Sn

<0.001

ICP-AES

Cu

2~20

ICP-AES

Sb

<0.001

ICP-AES

Si

<0.005

ICP-AES

Ni

<0.005

ICP-AES

Mg

<0.005

ICP-AES

Ca

<0.001

ICP-AES

Mn

<0.004

ICP-AES

Pt

<0.001

ICP-AES

Gas Impurities

Element

Value(%)

Element

Value(%)

C

≤0.005

O

≤0.10

N

≤0.003

P

≤0.005

Particle Size Distribution:

Density(g/cm³)

Hall Flow Rate(s/50g)

Apparent Density

Tap Density

Value

≥6.0

≥7.5

≤10.0

Particle Size Distribution:

5-25μm(D10=5~10μm、D50=15~20μm、D90=20~25μm)
15-45μm(D10=15~20μm、D50=25~30μm、D90=35~40μm)
15-53μm(D10=15~20μm、D50=25~35μm、D90=45~50μm)
45-75μm(D10=45~55μm、D50=55~65μm、D90=70~75μm)
45-105μm(D10=50~60μm、D50=75~85μm、D90=95~105μm)
75-150μm(D10=80~90μm、D50=110~125μm、D90=135~150μm)
A unimodal normal distribution is shown, and the laser granularity distribution can refer to the following figure.
SEM (scanning electron microscope):
  

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