Indium-based Metallic bonding...
Indium-based Metallic bonding utilizes an Indium Alloy and is rated to 150 degrees C. It provides good thermal and electrical conductivity and is recommended for most sputtering applications.
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Indium has the best thermal conductivity of all available bonds and is the most efficient at drawing heat away from the target. Indium is also more malleable than other bonding solders and therefore it is more forgiving. An Indium-based Metallic bond provides good thermal and electrical conductivity and is recommended for most sputtering applications.
Highest thermally conductive bond offered
Thorough bond coverage
Malleable solder allows for thermal expansion during sputtering
Provides support for fragile target materials
Compatible with a wide range of target materials
Maximum Operating Temperature (°C)
Thermal Conductivity (W/mK)
Coefficient of Thermal Expansion (K-1)
32.1 x 10-6
Electrical Resistivity (ohm-cm)
8 x 10-6
Bond Line Thickness
0.010" ± 0.003"
The melting point of indium is 156.6°C so temperatures in excess of 150°C will cause the bond to melt and fail. Most materials can be indium bonded but there are a few exceptions, please chose the best bonding method for your sputtering targets.