Elastomer is an alternative bonding...
Elastomer is an alternative bonding method that touts a higher temperature capability over the indium bond. Elastomer bonds are recommended when customers are consistently melting indium bonds. The major advantages of Elastomer bonding are its low cure temperature (reducing internal bond stresses from thermal miss match) and high operation temperature (250 °C).
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Low cure temperature
High operation temperature (250 °C)
Larger dimensions of sputtering target and backing plate
Maximum Operating Temperature (°C)
250 ° C
Thermal Conductivity (W/mK)
Coefficient of Thermal Expansion (K-1)
2.2 x 10-4
Electrical Resistivity (ohm-cm)
Bond Line Thickness
0.010” – 0.025”
Please chose the best bonding method for your sputtering targets.
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